Non-Contact End Effector for Ultra thin Wafer"FLOAT CHUCK TypeFTU" floats Ultra thin Waferin the air by spouting gas toward Ultra thin Wafer.
Non-Contact End Effctor( Bernoulli chuck) "FLOAT CHUCK TypeFTU" gas jet mechanism is a perpendicular revolution style system in which gas
blows off from the lower part of the gas jet pipe prepared in the cushion
room central part in the shape of radiation, and gas circles the cushion
room.
For this reason, the partial negative pressure is not generated in the
central part. So stress does not cause on ultra thin wafers, glasses etc.
There are nothings partial negative pressure arose by this in the central
part which is the fault of a former type level revolution style system,
the ultra thin wafer is made to produce stress, and the problem of sometimes
damaging a wafer was solved.
Moreover, the amount of air consumption comparing with the former Non-Contact End Effector( Bernoulli chuck) "FLOAT CHUCK TypeFTU" is about 1/2 energy-saving type.
Non-contacting conveyance of the large-sized glass substrate which was
a pending question was enabled because the amount of air consumption is
large.
◎Feature
１．Stressis not applied on Ultra thin Wafer（２０μm thickness）
２．Don't Damage Weak Work.
３． Conveyance of Flexible Work is Possible.
４．Conveyance of Film is Possible
５． Breathability Works, Such as Nonwoven Fabric
and Paper Conveyance is Possible.
Conveyance is Possible.
◎Adaptation
１． Ultra thin wafer
２． LCD glass substrate
３． Ceramic green sheet
４．Photovoltaic solar cell
５．Film
